AMPECS projects aims at developing a new Multi-material Additive Manufacturing technology to build up ceramic solid parts with 3D printed electronics embedded in its structure. This new technology might allow the possibility to manufacture smaller and more efficiently electronic devices.
In order to achieve AMPECS objectives a multi-material 5-axis printing process will be developed enabling the possibility to build-up more complex shapes without using support material and printing electronics on different planes will be a completely new approach in that field.
AMPECS will develop new technologies and processes for applied 3D System integration and packaging technology for electronics and sensors in the smallest space. The result will be a powerful industrial tool for European companies to produce novel, miniaturized 3D electronic systems with low cost and a high level of customisation
